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DAC
2009
ACM
15 years 11 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
DAC
2009
ACM
15 years 11 months ago
Spectral techniques for high-resolution thermal characterization with limited sensor data
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
Ryan Cochran, Sherief Reda
DAC
2009
ACM
15 years 11 months ago
Process variation characterization of chip-level multiprocessors
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...
DAC
2008
ACM
15 years 11 months ago
On reliable modular testing with vulnerable test access mechanisms
In modular testing of system-on-a-chip (SoC), test access mechanisms (TAMs) are used to transport test data between the input/output pins of the SoC and the cores under test. Prio...
Lin Huang, Feng Yuan, Qiang Xu
DAC
2007
ACM
15 years 11 months ago
A System For Coarse Grained Memory Protection In Tiny Embedded Processors
Many embedded systems contain resource constrained microcontrollers where applications, operating system components and device drivers reside within a single address space with no...
Ram Kumar, Akhilesh Singhania, Andrew Castner, Edd...