Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...
In modular testing of system-on-a-chip (SoC), test access mechanisms (TAMs) are used to transport test data between the input/output pins of the SoC and the cores under test. Prio...
Many embedded systems contain resource constrained microcontrollers where applications, operating system components and device drivers reside within a single address space with no...
Ram Kumar, Akhilesh Singhania, Andrew Castner, Edd...