15317 search results - page 2948 / 3064 » Globally Distributed Data |
138
click to vote
HPCA
2007
IEEE
16 years 5 months ago
2007
IEEE
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
126
click to vote
HPCA
2007
IEEE
16 years 5 months ago
2007
IEEE
This paper proposes a hardware transactional memory (HTM) system called LogTM Signature Edition (LogTM-SE). LogTM-SE uses signatures to summarize a transaction's readand writ...
148
click to vote
HPCA
2007
IEEE
16 years 5 months ago
2007
IEEE
Memory bugs are a broad class of bugs that is becoming increasingly common with increasing software complexity, and many of these bugs are also security vulnerabilities. Unfortuna...
141
click to vote
HPCA
2007
IEEE
16 years 5 months ago
2007
IEEE
Chip multiprocessors with multiple simpler cores are gaining popularity because they have the potential to drive future performance gains without exacerbating the problems of powe...
174
Voted
HPCA
2007
IEEE
16 years 5 months ago
2007
IEEE
It is widely accepted that transient failures will appear more frequently in chips designed in the near future due to several factors such as the increased integration scale. On t...