165 search results - page 23 / 33 » Heterogeneous systems on chip and systems in package |
82
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DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of megahertz, and in several cases exceeding the gigahertz r...
115
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AHS
2006
IEEE
15 years 1 months ago
2006
IEEE
We propose a novel type of dynamically reconfigurable System-on-Chip architecture, the Gannet service-based architecture. This novel concept addresses the issue of systemlevel rec...
ICCD
2002
IEEE
15 years 6 months ago
2002
IEEE
The requirements to system and software development tools brought up by the automotive industry differ from the requirements that other customers have. The important catchwords he...
CORR
2011
Springer
14 years 1 months ago
2011
Springer
Modern high-end machines feature multiple processor packages, each of which contains multiple independent cores and integrated memory controllers connected directly to dedicated p...
SLIP
2009
ACM
15 years 4 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...