34 search results - page 3 / 7 » High Density Through Silicon Via (TSV) |
SLIP
2009
ACM
14 years 22 days ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
NANONET
2009
Springer
13 years 10 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
3DIC
2009
IEEE
14 years 1 months ago
2009
IEEE
—The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing Through Silicon Vias (TSV) for vertical connectivity is investigated with a cycle-a...
ISPD
2011
ACM
12 years 9 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
DATE
2009
IEEE
14 years 1 months ago
2009
IEEE
Abstract—Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption...