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HPCA
2007
IEEE
15 years 9 months ago
Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
Kiran Puttaswamy, Gabriel H. Loh
HPCC
2007
Springer
15 years 3 months ago
Performance Evaluation of Distributed Computing over Heterogeneous Networks
RWAPI is a low-level communication interface designed for clusters of PCs. It has been developed to provide performance to higher applications on a wide variety of architectures. W...
Ouissem Ben Fredj, Éric Renault
86
Voted
CODES
2006
IEEE
15 years 3 months ago
System-level power-performance trade-offs in bus matrix communication architecture synthesis
System-on-chip communication architectures have a significant impact on the performance and power consumption of modern multiprocessor system-on-chips (MPSoCs). However, customiza...
Sudeep Pasricha, Young-Hwan Park, Fadi J. Kurdahi,...
SIGCOMM
2000
ACM
15 years 1 months ago
Endpoint admission control: Architectural issues and performance
The traditional approach to implementing admission control, as exemplified by the Integrated Services proposal in the IETF, uses a signalling protocol to establish reservations a...
Lee Breslau, Edward W. Knightly, Scott Shenker, Io...
TMC
2010
190views more  TMC 2010»
14 years 7 months ago
SAMAC: A Cross-Layer Communication Protocol for Sensor Networks with Sectored Antennas
—Wireless sensor networks have been used to gather data and information in many diverse application settings. The capacity of such networks remains a fundamental obstacle toward ...
Emad Felemban, Serdar Vural, Robert Murawski, Eyle...