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TCAD
2008
114views more  TCAD 2008»
14 years 9 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CIKM
2004
Springer
15 years 3 months ago
RStar: an RDF storage and query system for enterprise resource management
Modern corporations operate in an extremely complex environment and strongly depend on all kinds of information resources across the enterprise. Unfortunately, with the growth of ...
Li Ma, Zhong Su, Yue Pan, Li Zhang, Tao Liu
ICN
2007
Springer
15 years 3 months ago
Toward Broad-Spectrum Autonomic Management
— The fields of autonomics and system configuration share a common goal in decreasing the cost of ownership of large fabrics. In this paper we present a combined vision in whic...
Edmund Smith, Paul Anderson
ATAL
2005
Springer
15 years 3 months ago
An agent-based approach for managing symbiotic simulation of semiconductor assembly and test operation
The rapid changing business environment of high-tech asset intensive enterprises such as semiconductor manufacturing constantly drives production managers to look for better solut...
Malcolm Yoke-Hean Low, Kong Wei Lye, Peter Lenderm...
APSEC
2005
IEEE
15 years 3 months ago
Feature Analysis for Service-Oriented Reengineering
Web Services together with Service-Oriented Architectures (SOA) are playing an important role in the future of distributed computing, significantly impacting software development ...
Feng Chen, Shaoyun Li, William Cheng-Chung Chu