In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
Abstract— The amount of energy consumed for interconnecting the IP-blocks is increasing significantly due to the suboptimal scaling of long wires. To limit this energy penalty, ...
Jin Guo, Antonis Papanikolaou, Pol Marchal, Franck...
Leisure-time physical activity (LTPA) has been shown to be an effective way of preventing diseases. However 50% of the people who start any type of sports or LTPA drop out of the ...
Creating artificial life forms through evolutionary robotics faces a “chicken and egg” problem: learning to control a complex body is dominated by problems specific to its s...
Nanometer CMOS scaling has resulted in greatly increased circuit variability, with extremely adverse consequences on design predictability and yield. A number of recent works have...
Ashoka Visweswara Sathanur, Antonio Pullini, Luca ...