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DAC
2011
ACM
14 years 4 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
CVPR
2008
IEEE
15 years 4 months ago
Tracking distributions with an overlap prior
Recent studies have shown that embedding similarity/dissimilarity measures between distributions in the variational level set framework can lead to effective object segmentation/t...
Ismail Ben Ayed, Shuo Li, Ian G. Ross
161
Voted
CVPR
2012
IEEE
13 years 6 months ago
Center-Shift: An approach towards automatic robust mesh segmentation (ARMS)
In the area of 3D shape analysis, research in mesh segmentation has always been an important topic, as it is a fundamental low-level task which can be utilized in many application...
Mengtian Sun, Yi Fang, Karthik Ramani
CVPR
2012
IEEE
13 years 6 months ago
Finite Element based sequential Bayesian Non-Rigid Structure from Motion
Navier’s equations modelling linear elastic solid deformations are embedded within an Extended Kalman Filter (EKF) to compute a sequential Bayesian estimate for the Non-Rigid St...
Antonio Agudo, Begoña Calvo, J. M. M. Monti...
CVPR
1998
IEEE
16 years 6 months ago
Action Recognition Using Probabilistic Parsing
A new approach to the recognition of temporal behaviors and activities is presented. The fundamental idea, inspired by work in speech recognition, is to divide the inference probl...
Aaron F. Bobick, Yuri A. Ivanov
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