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TEI
2012
ACM
258views Hardware» more  TEI 2012»
13 years 10 months ago
The HapticTouch toolkit: enabling exploration of haptic interactions
In the real world, touch based interaction relies on haptic feedback (e.g., grasping objects, feeling textures). Unfortunately, such feedback is absent in current tabletop systems...
David Ledo, Miguel A. Nacenta, Nicolai Marquardt, ...
ISCA
2006
IEEE
154views Hardware» more  ISCA 2006»
15 years 9 months ago
SODA: A Low-power Architecture For Software Radio
The physical layer of most wireless protocols is traditionally implemented in custom hardware to satisfy the heavy computational requirements while keeping power consumption to a ...
Yuan Lin, Hyunseok Lee, Mark Woh, Yoav Harel, Scot...
WOSP
2005
ACM
15 years 8 months ago
Performance by unified model analysis (PUMA)
Evaluation of non-functional properties of a design (such as performance, dependability, security, etc.) can be enabled by design annotations specific to the property to be evalua...
C. Murray Woodside, Dorina C. Petriu, Dorin Bogdan...
VLSID
2007
IEEE
231views VLSI» more  VLSID 2007»
16 years 3 months ago
AHIR: A Hardware Intermediate Representation for Hardware Generation from High-level Programs
We present AHIR, an intermediate representation (IR), that acts as a transition layer between software compilation and hardware synthesis. Such a transition layer is intended to t...
Sameer D. Sahasrabuddhe, Hakim Raja, Kavi Arya, Ma...
ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
15 years 11 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...