In wireless networks, the knowledge of nodal distances is essential for performance analysis and protocol design. When determining distance distributions in random networks, the u...
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
This paper presents the first analysis on the energy efficiency of LT codes with Non-Coherent M-ary Frequency Shift Keying (NCMFSK), known as green modulation [1], in a proactive W...
Jamshid Abouei, J. David Brown, Konstantinos N. Pl...
The focus of this work is on the analysis of transmit beamforming schemes with a low-rate feedback link in wireless sensor/relay networks, where nodes in the network need to imple...
Abstract--We investigate the relay selection problem in a network where users are able to collaborate with each other; decode and forward the messages of each other along with thei...