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SIGCSE
2009
ACM
139views Education» more  SIGCSE 2009»
15 years 10 months ago
Abstraction and extensibility in digital logic simulation software
ion and Extensibility in Digital Logic Simulation Software Richard M. Salter and John L. Donaldson Computer Science Department Oberlin College Oberlin, OH 44074 rms@cs.oberlin.edu,...
Richard M. Salter, John L. Donaldson
ISPD
2010
ACM
195views Hardware» more  ISPD 2010»
15 years 4 months ago
Density gradient minimization with coupling-constrained dummy fill for CMP control
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
Huang-Yu Chen, Szu-Jui Chou, Yao-Wen Chang
76
Voted
GLVLSI
2003
IEEE
134views VLSI» more  GLVLSI 2003»
15 years 3 months ago
Modeling QCA for area minimization in logic synthesis
Concerned by the wall that Moore’s Law is expected to hit in the next decade, the integrated circuit community is turning to emerging nanotechnologies for continued device impro...
Nadine Gergel, Shana Craft, John Lach
82
Voted
DAC
2006
ACM
15 years 3 months ago
Visibility enhancement for silicon debug
Several emerging Design-for-Debug (DFD) methodologies are addressing silicon debug by making internal signal values and other data observable. Most of these methodologies require ...
Yu-Chin Hsu, Fur-Shing Tsai, Wells Jong, Ying-Tsai...
ASPDAC
2005
ACM
134views Hardware» more  ASPDAC 2005»
15 years 3 months ago
Wire congestion and thermal aware 3D global placement
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Karthik Balakrishnan, Vidit Nanda, Siddharth Easwa...