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DATE
2010
IEEE
162views Hardware» more  DATE 2010»
15 years 2 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
CA
2002
IEEE
15 years 2 months ago
A Hybrid Dynamical Systems Approach to Intelligent Low-Level Navigation
Animated characters may exhibit several kinds of dynamic intelligence when performing low-level navigation (i.e., navigation on a local perceptual scale): They decide among differ...
Eric Aaron, Harold C. Sun, Franjo Ivancic, Dimitri...
MICRO
2002
IEEE
113views Hardware» more  MICRO 2002»
15 years 2 months ago
Vacuum packing: extracting hardware-detected program phases for post-link optimization
This paper presents Vacuum Packing, a new approach to profile-based program optimization. Instead of using traditional aggregate or summarized execution profile weights, this ap...
Ronald D. Barnes, Erik M. Nystrom, Matthew C. Mert...
AI
2010
Springer
15 years 2 months ago
A Three-Way Decision Approach to Email Spam Filtering
Many classification techniques used for identifying spam emails, treat spam filtering as a binary classification problem. That is, the incoming email is either spam or non-spam....
Bing Zhou, Yiyu Yao, Jigang Luo
ESWS
2010
Springer
15 years 2 months ago
Facet Graphs: Complex Semantic Querying Made Easy
While the Semantic Web is rapidly filling up, appropriate tools for searching it are still at infancy. In this paper we describe an approach that allows humans to access informatio...
Philipp Heim, Thomas Ertl, Jürgen Ziegler