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SLIP
2009
ACM
15 years 8 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
SOUPS
2009
ACM
15 years 8 months ago
Not one click for security?
: © Not One Click for Security Alan H. Karp, Marc Stiegler, Tyler Close HP Laboratories HPL-2009-53 Secure cooperation, usable security Conventional wisdom holds that security mus...
Alan H. Karp, Marc Stiegler, Tyler Close
WOWMOM
2009
ACM
146views Multimedia» more  WOWMOM 2009»
15 years 8 months ago
Optimization of WiMax modulation scheme with a cross layer erasure code
WIMAX (Worldwide Interoperability for Microwave Access) is a promising new networking technology that potentially offers high speed and wide area wireless access services that com...
Lei Zhang, Patrick Sénac, Roksana Boreli, M...
CHI
2010
ACM
15 years 8 months ago
Generating default privacy policies for online social networks
Default privacy policies have a significant impact on the overall dynamics and success of online social networks, as users tend to keep their initial privacy policies. In this wor...
Eran Toch, Norman M. Sadeh, Jason I. Hong
ACSC
2008
IEEE
15 years 8 months ago
Product flow analysis in distribution networks with a fixed time horizon
The movement of items through a product distribution network is a complex dynamic process which depends not only on the network’s static topology but also on a knowledge of how ...
Moe Thandar Wynn, Colin J. Fidge, Arthur H. M. ter...