357 search results - page 20 / 72 » No new wires |
ICCD
2005
IEEE
15 years 9 months ago
2005
IEEE
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
SLIP
2009
ACM
15 years 7 months ago
2009
ACM
An accurate model for pre-placement wire length estimation can be a useful tool during the physical design of integrated circuits. In this paper, an a priori wire length estimatio...
76
Voted
HAPTICS
2007
IEEE
15 years 6 months ago
2007
IEEE
In this paper, we propose a new haptic interface based on measurement of two-dimensional patterns of myoelectric potentials on a surface of a forearm. A myoelectric signal is an e...
104
click to vote
MOBIQUITOUS
2005
IEEE
15 years 6 months ago
2005
IEEE
As wireless networks become more prevalent, users will demand the same applications that are currently available in wired networks. Further, they will expect to receive a quality ...
92
Voted
ASPDAC
1998
ACM
15 years 4 months ago
1998
ACM
ABSTRACT - This paper presents a new design flow, FPDSiMPA, and a set of techniques for synthesizing high-performance sub-half micron logic circuits. FPD-SiMPA consists of logic p...