357 search results - page 68 / 72 » No new wires |
MICRO
2006
IEEE
15 years 6 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ASPDAC
2006
ACM
15 years 6 months ago
2006
ACM
— Due to its great flexibility, gridless routing is desirable for nanometer circuit designs that use variable wire widths and spacings. Nevertheless, it is much more difficult ...
132
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MM
2006
ACM
15 years 6 months ago
2006
ACM
While there have been great advances in quantification of the genotype of organisms, including full genomes for many species, the quantification of phenotype is at a comparatively...
92
Voted
ISQED
2005
IEEE
15 years 5 months ago
2005
IEEE
Due to the rapid development of manufacturing process technology and tight marketing schedule, the chip design and manufacturing always work toward an integrated solution to achie...
105
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MSWIM
2003
ACM
15 years 5 months ago
2003
ACM
Errors introduced by a wireless medium are more frequent and profound than contemporary wired media. Some of these errors, which are not corrected by the physical layer, result in...