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ICCD
2002
IEEE
15 years 8 months ago
2002
IEEE
A large and increasing number of modern embedded systems are subject to tight power/energy constraints. It has been demonstrated that the operating system (OS) can have a signifi...
ICCAD
2008
IEEE
15 years 8 months ago
2008
IEEE
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
97
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ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
Process variations in modern VLSI technologies are growing in both magnitude and dimensionality. To assess performance variability, complex simulation and performance models param...
74
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ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....