Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Abstract--In this paper, we study wire width planning for interconnect performance optimization in an interconnect-centric design flow. We first propose some simplified, yet near-o...
Achieving a high quality and cost-effective tests is a major concern for software buyers and sellers. Using tools and integrating techniques to carry out low cost testing are chal...
Salah Bouktif, Giuliano Antoniol, Ettore Merlo, Ma...
We consider human performance on an optimal stopping problem where people are presented with a list of numbers independently chosen from a uniform distribution. People are told ho...
Markov Networks (also known as Markov Random Fields) have been proposed as a new approach to probabilistic modelling in Estimation of Distribution Algorithms (EDAs). An EDA employ...
Alexander E. I. Brownlee, John A. W. McCall, Deryc...