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» Performance modeling of component assemblies
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136
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OOPSLA
2010
Springer
15 years 1 months ago
An input-centric paradigm for program dynamic optimizations
Accurately predicting program behaviors (e.g., locality, dependency, method calling frequency) is fundamental for program optimizations and runtime adaptations. Despite decades of...
Kai Tian, Yunlian Jiang, Eddy Z. Zhang, Xipeng She...
192
Voted
MJ
2011
288views Multimedia» more  MJ 2011»
14 years 10 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
139
Voted
CODES
2004
IEEE
15 years 7 months ago
Fast exploration of bus-based on-chip communication architectures
As a result of improvements in process technology, more and more components are being integrated into a single System-on-Chip (SoC) design. Communication between these components ...
Sudeep Pasricha, Nikil D. Dutt, Mohamed Ben-Romdha...
145
Voted
UAI
2008
15 years 4 months ago
Modelling local and global phenomena with sparse Gaussian processes
Much recent work has concerned sparse approximations to speed up the Gaussian process regression from the unfavorable O(n3 ) scaling in computational time to O(nm2 ). Thus far, wo...
Jarno Vanhatalo, Aki Vehtari
ICCAD
2008
IEEE
105views Hardware» more  ICCAD 2008»
16 years 12 days ago
Parameterized transient thermal behavioral modeling for chip multiprocessors
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Mur...