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109
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CSO
2009
IEEE
15 years 4 months ago
2009
IEEE
With the development of modern electronic and computer technologies, sports training and competition became more and more technical. A great deal of data were recorded, including ...
101
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EUROPAR
2010
Springer
14 years 9 months ago
2010
Springer
Today, it is possible to associate multiple CPUs and multiple GPUs in a single shared memory architecture. Using these resources efficiently in a seamless way is a challenging issu...
ICCAD
2010
IEEE
14 years 7 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ICCAD
2004
IEEE
15 years 6 months ago
2004
IEEE
Traditional timing-driven placement considers only combinational delays and does not take into account the potential of subsequent sequential optimization steps. As a result, the ...
ISPD
2010
ACM
15 years 4 months ago
2010
ACM
As the thermal wall becomes the dominant factor limiting VLSI circuit performance, and the interconnect wires become the primary power consumer, power efficiency of onchip data th...