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DATE
2009
IEEE
155views Hardware» more  DATE 2009»
15 years 4 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
MICRO
2003
IEEE
125views Hardware» more  MICRO 2003»
15 years 2 months ago
Runtime Power Monitoring in High-End Processors: Methodology and Empirical Data
With power dissipation becoming an increasingly vexing problem across many classes of computer systems, measuring power dissipation of real, running systems has become crucial for...
Canturk Isci, Margaret Martonosi
70
Voted
DAC
2008
ACM
15 years 10 months ago
A power and temperature aware DRAM architecture
Technological advances enable modern processors to utilize increasingly larger DRAMs with rising access frequencies. This is leading to high power consumption and operating temper...
Song Liu, Seda Ogrenci Memik, Yu Zhang, Gokhan Mem...
78
Voted
ICS
2005
Tsinghua U.
15 years 3 months ago
A performance-conserving approach for reducing peak power consumption in server systems
The combination of increasing component power consumption, a desire for denser systems, and the required performance growth in the face of technology-scaling issues are posing eno...
Wesley M. Felter, Karthick Rajamani, Tom W. Keller...
77
Voted
DAC
1996
ACM
15 years 1 months ago
Glitch Analysis and Reduction in Register Transfer Level
: We presentdesign-for-low-power techniques based on glitch reduction for register-transfer level circuits. We analyze the generation and propagation of glitches in both the contro...
Anand Raghunathan, Sujit Dey, Niraj K. Jha