— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
—X-filling is preferred for low-capture-power scan test generation, since it reduces IR-drop-induced yield loss without the need of any circuit modification. However, the effecti...
Xiaoqing Wen, Kohei Miyase, Tatsuya Suzuki, Yuta Y...
Power is considered to be the major limiter to the design of more faster and complex processors in the near future. In order to address this challenge, a combination of process, c...
David Duarte, Narayanan Vijaykrishnan, Mary Jane I...
We look at iterated power generators si = se i−1 mod N for a random seed s0 ∈ ZN that in each iteration output a certain amount of bits. We show that heuristically an output of...
Testing of VLSI circuits can cause generation of excessive heat which can damage the chips under test. In the random testing environment, high-performance CMOS circuits consume sig...
Artem Sokolov, Alodeep Sanyal, L. Darrell Whitley,...