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DATE
2009
IEEE
161views Hardware» more  DATE 2009»
15 years 5 months ago
Co-design of signal, power, and thermal distribution networks for 3D ICs
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
ICCD
2006
IEEE
84views Hardware» more  ICCD 2006»
15 years 8 months ago
Highly-Guided X-Filling Method for Effective Low-Capture-Power Scan Test Generation
—X-filling is preferred for low-capture-power scan test generation, since it reduces IR-drop-induced yield loss without the need of any circuit modification. However, the effecti...
Xiaoqing Wen, Kohei Miyase, Tatsuya Suzuki, Yuta Y...
ICCD
2002
IEEE
93views Hardware» more  ICCD 2002»
15 years 8 months ago
Impact of Scaling on the Effectiveness of Dynamic Power Reduction Schemes
Power is considered to be the major limiter to the design of more faster and complex processors in the near future. In order to address this challenge, a combination of process, c...
David Duarte, Narayanan Vijaykrishnan, Mary Jane I...
ASIACRYPT
2009
Springer
15 years 5 months ago
Attacking Power Generators Using Unravelled Linearization: When Do We Output Too Much?
We look at iterated power generators si = se i−1 mod N for a random seed s0 ∈ ZN that in each iteration output a certain amount of bits. We show that heuristically an output of...
Mathias Herrmann, Alexander May
CEC
2005
IEEE
15 years 4 months ago
Dynamic power minimization during combinational circuit testing as a traveling salesman problem
Testing of VLSI circuits can cause generation of excessive heat which can damage the chips under test. In the random testing environment, high-performance CMOS circuits consume sig...
Artem Sokolov, Alodeep Sanyal, L. Darrell Whitley,...