Abstract— Power consumption has become a crucial problem in modern circuit design. Multiple Supply Voltage (MSV) design is introduced to provide higher flexibility in controllin...
Electrostatic analysis of complicated molecular surfaces arises in a number of nanotechnology applications including: biomolecule design, carbon nanotube simulation, and molecular...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
In GIS and spatial databases, cardinal directions are frequently used as selection and join criteria in query languages. However, most cardinal direction models are only able to h...