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ICCAD
2008
IEEE
122views Hardware» more  ICCAD 2008»
16 years 3 months ago
Network flow-based power optimization under timing constraints in MSV-driven floorplanning
Abstract— Power consumption has become a crucial problem in modern circuit design. Multiple Supply Voltage (MSV) design is introduced to provide higher flexibility in controllin...
Qiang Ma, Evangeline F. Y. Young
ICCAD
2006
IEEE
101views Hardware» more  ICCAD 2006»
16 years 3 months ago
A spectrally accurate integral equation solver for molecular surface electrostatics
Electrostatic analysis of complicated molecular surfaces arises in a number of nanotechnology applications including: biomolecule design, carbon nanotube simulation, and molecular...
Shih-Hsien Kuo, Jacob White
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICCAD
2002
IEEE
161views Hardware» more  ICCAD 2002»
16 years 3 months ago
Non-tree routing for reliability and yield improvement
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
Andrew B. Kahng, Bao Liu, Ion I. Mandoiu
SAC
2010
ACM
16 years 1 months ago
Modeling cardinal directions in the 3D space with the objects interaction cube matrix
In GIS and spatial databases, cardinal directions are frequently used as selection and join criteria in query languages. However, most cardinal direction models are only able to h...
Tao Chen, Markus Schneider
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