3771 search results - page 375 / 755 » Process modeling for future technologies |
126
Voted
ASPDAC
2012
ACM
14 years 26 days ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
140
Voted
ICIS
2003
15 years 6 months ago
2003
ThelinkagesbetweenISandbusinessunitsarerecognizedasbeingcriticaltoinformationsystemsdevelopment processes and outcomes. Previous research has found that they are associated with b...
133
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ECIR
2007
Springer
15 years 6 months ago
2007
Springer
The amount of data exponentially increases in information systems and it becomes more and more difficult to extract the most relevant information within a very short time. Among ot...
141
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HT
2007
ACM
15 years 9 months ago
2007
ACM
Customers are driving down lead times for software, especially for Web applications, to only a few months. While a number of hypertext design models exist, they do not address the...
143
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OHS
2000
Springer
15 years 8 months ago
2000
Springer
Abstract. Structural computing is a new paradigm for developing applications in new domains. One of its benefits is that adaptation of behavior--as a consequence of changes of the ...