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ACHI
2009
IEEE
15 years 4 months ago
3D Audio Perception System for Humanoid Robots
An audio system is one of the basic components of a humanoid robot designed for natural interaction. For many interaction purposes it is sufficient to use the sound detection and...
Norbert Schmitz, Carsten Spranger, Karsten Berns
DATE
2010
IEEE
162views Hardware» more  DATE 2010»
15 years 2 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
15 years 3 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
ISCA
2008
IEEE
116views Hardware» more  ISCA 2008»
15 years 4 months ago
3D-Stacked Memory Architectures for Multi-core Processors
Three-dimensional integration enables stacking memory directly on top of a microprocessor, thereby significantly reducing wire delay between the two. Previous studies have examin...
Gabriel H. Loh
ISPD
2011
ACM
253views Hardware» more  ISPD 2011»
14 years 19 days ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig