7580 search results - page 1385 / 1516 » Prometheus design tool |
138
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ICCAD
2005
IEEE
16 years 1 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
139
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WWW
2010
ACM
15 years 11 months ago
2010
ACM
With the explosive growth of digital cameras and online media, it has become crucial to design efficient methods that help users browse and search large image collections. The rec...
185
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WWW
2010
ACM
15 years 11 months ago
2010
ACM
Privacy is an enormous problem in online social networking sites. While sites such as Facebook allow users fine-grained control over who can see their profiles, it is difficult ...
154
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ECBS
2009
IEEE
15 years 11 months ago
2009
IEEE
Future space missions, such as Mars Science Laboratory, are built upon computing platforms providing a high degree of autonomy and diverse functionality. The increased sophisticat...
139
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FPGA
2009
ACM
15 years 11 months ago
2009
ACM
Aggressive scaling increases the number of devices we can integrate per square millimeter but makes it increasingly difficult to guarantee that each device fabricated has the inte...