In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
We introduce the interactive system “Beady” to assist the design and construction of customized 3D beadwork. The user first creates a polygonal mesh model called the design m...
Large-scale process variations can significantly limit the practical utility of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we desc...
Fa Wang, Gokce Keskin, Andrew Phelps, Jonathan Rot...
In this paper, we develop a unified theory in analyzing optimal switch box design problems, particularly for the unsolved irregular cases, where different pin counts are allowed on...
Abstract. Performance evaluation of the Advanced Encryption Standard candidates has led to intensive study of both hardware and software implementations. However, although plentifu...