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134
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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
15 years 2 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
TOG
2012
206views Communications» more  TOG 2012»
13 years 7 months ago
Beady: interactive beadwork design and construction
We introduce the interactive system “Beady” to assist the design and construction of customized 3D beadwork. The user first creates a polygonal mesh model called the design m...
Yuki Igarashi, Takeo Igarashi, Jun Mitani
153
Voted
DAC
2012
ACM
13 years 7 months ago
Statistical design and optimization for adaptive post-silicon tuning of MEMS filters
Large-scale process variations can significantly limit the practical utility of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we desc...
Fa Wang, Gokce Keskin, Andrew Phelps, Jonathan Rot...
FPL
2004
Springer
100views Hardware» more  FPL 2004»
15 years 8 months ago
On Optimal Irregular Switch Box Designs
In this paper, we develop a unified theory in analyzing optimal switch box design problems, particularly for the unsolved irregular cases, where different pin counts are allowed on...
Hongbing Fan, Yu-Liang Wu, Chak-Chung Cheung, Jipi...
CHES
2003
Springer
146views Cryptology» more  CHES 2003»
15 years 8 months ago
Efficient Implementation of Rijndael Encryption in Reconfigurable Hardware: Improvements and Design Tradeoffs
Abstract. Performance evaluation of the Advanced Encryption Standard candidates has led to intensive study of both hardware and software implementations. However, although plentifu...
François-Xavier Standaert, Gaël Rouvro...