8 search results - page 2 / 2 » SESAME-P: Memory Pool-Based Dynamic Stack Management for Sen... |
146
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TCAD
2008
15 years 2 months ago
2008
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
140
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ICCAD
2010
IEEE
15 years 27 days ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
148
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EMSOFT
2005
Springer
15 years 8 months ago
2005
Springer
Real-time systems have reached a level of complexity beyond the scaling capability of the low-level or restricted languages traditionally used for real-time programming. While Met...