Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Image matting is the problem of determining for each pixel in an image whether it is foreground, background, or the mixing parameter, ”alpha”, for those pixels that are a mixt...
In a dynamic market, being able to update one’s value based on information available to other bidders currently in the market can be critical to having profitable transactions. ...
In this paper, we present an AUC (i.e., the Area Under the Curve of Receiver Operating Characteristics (ROC)) maximization based learning algorithm to design the classifier for ma...
For an increasing number of modern database applications, efficient support of similarity search becomes an important task. Along with the complexity of the objects such as images...