Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Current VLSI technology allows more than two wiring layers and the number is expected to rise in future. In this paper, we show that, by designing VLSI layouts directly for an L-l...
Chi-Hsiang Yeh, Emmanouel A. Varvarigos, Behrooz P...
Abstract—In this paper we ask which properties of a distributed network can be computed from a few amount of local information provided by its nodes. The distributed model we con...
Abstract. Coordination languages are intended to simplify the development of complex software systems by separating the coordination aspects of an application from its computation ...
Alessandra Di Pierro, Chris Hankin, Herbert Wiklic...
Extraction-Transformation-Loading (ETL) tools are pieces of software responsible for the extraction of data from several sources, their cleansing, customization and insertion into ...