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TPDS
1998
14 years 9 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
116
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HPDC
2012
IEEE
13 years 7 days ago
2012
IEEE
networking with a layer 2 abstraction provides a powerful model for virtualized wide-area distributed computing resources, including for high performance computing (HPC) on collec...
102
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CASES
2005
ACM
14 years 11 months ago
2005
ACM
In this work, we propose and investigate the idea of enhancing a System-on-Chip (SoC) communication architecture (the fabric that integrates system components and carries the comm...
FORTE
2008
14 years 11 months ago
2008
The paper studies a distributed implementation method for the BIP (Behavior, Interaction, Priority) component framework for modeling heterogeneous systems. BIP offers two powerful ...
CLUSTER
2008
IEEE
15 years 4 months ago
2008
IEEE
—The industry is now in agreement that the future of architecture design lies in multiple cores. As a consequence, all computer systems today, from embedded devices to petascale ...