5111 search results - page 912 / 1023 » The Embedded Systems Design Challenge |
DATE
2007
IEEE
15 years 11 months ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
138
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DSN
2007
IEEE
15 years 11 months ago
2007
IEEE
HTTP cookies have been widely used for maintaining session states, personalizing, authenticating, and tracking user behaviors. Despite their importance and usefulness, cookies hav...
156
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HICSS
2007
IEEE
15 years 11 months ago
2007
IEEE
Effective provisioning of next generation distributed applications hosted on diverse middleware platforms incurs significant challenges due to the applications’ growing complex...
153
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INFOCOM
2007
IEEE
15 years 11 months ago
2007
IEEE
Abstract—In this paper we address the problem of energyefficient event detection in wireless sensor networks (WSNs). Duty cycling is a fundamental approach to conserving energy i...
128
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IPPS
2007
IEEE
15 years 11 months ago
2007
IEEE
Fast hardware turnover in supercomputing centers, stimulated by rapid technological progress, results in high heterogeneity among HPC platforms, and necessitates that applications...