64 search results - page 3 / 13 » The Impact of Silicon Photonics |
NANONET
2009
Springer
13 years 10 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
CN
2000
13 years 6 months ago
2000
This contribution concentrates on dynamic routing in WDM (Wavelength Division Multiplexing) networks. It is shown that a strategy based on precalculated alternatives and an adapti...
DATE
2009
IEEE
14 years 1 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
GLVLSI
2010
IEEE
13 years 11 months ago
2010
IEEE
NBTI is one of the most important silicon reliability problems facing processor designers today. The impact of NBTI can be mitigated at both the circuit and microarchitecture leve...
SLIP
2009
ACM
14 years 24 days ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...