1516 search results - page 164 / 304 » The Increasing Nvalue Constraint |
124
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MICRO
2006
IEEE
15 years 10 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
124
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INFOCOM
2003
IEEE
15 years 9 months ago
2003
IEEE
— Input-queued switches are used extensively in the design of high-speed routers. As switch speeds and sizes increase, the design of the switch scheduler becomes a primary challe...
158
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CGO
2004
IEEE
15 years 7 months ago
2004
IEEE
To meet the high demand for powerful embedded processors, VLIW architectures are increasingly complex (e.g., multiple clusters), and moreover, they now run increasingly sophistica...
133
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INFOCOM
2009
IEEE
15 years 10 months ago
2009
IEEE
—Enterprise networks are increasingly adopting Layer 3 Multiprotocol Label Switching (MPLS) Virtual Private Network (VPN) technology to connect geographically disparate locations...
119
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INFOCOM
2008
IEEE
15 years 10 months ago
2008
IEEE
Abstract—Efficient operation of wireless networks requires distributed routing and scheduling algorithms that take into account interference constraints. Recently, a few algorit...