1023 search results - page 160 / 205 » The Simulation and Design of Integrated Inductors |
MOBIHOC
2008
ACM
15 years 9 months ago
2008
ACM
Local monitoring is an effective mechanism for the security of wireless sensor networks (WSNs). Existing schemes assume the existence of sufficient number of active nodes to carry...
ICCAD
2008
IEEE
15 years 6 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
ICCAD
2001
IEEE
15 years 6 months ago
2001
IEEE
This paper presents a new methodology for system-level power and performance analysis of wireless multimedia systems. More precisely, we introduce an analytical approach based on ...
SBCCI
2009
ACM
15 years 4 months ago
2009
ACM
The purpose of this work is the proposal of a 10-Bit / 1 MSPS Analog to Digital Converter (ADC) with error correction to match the requirements of a CMOS wavefront sensor for opht...
SLIP
2009
ACM
15 years 4 months ago
2009
ACM
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...