—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
Abstract: An optimization algorithm for the design of combinational circuits that are robust to single-event upsets (SEUs) is described. A simple, highly accurate model for the SEU...
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
Kelli Ireland, Donald M. Chiarulli, Steven P. Levi...
A novel topology for Translinear (TL) loops comprising of CMOS Second Generation Current Conveyors (CC-II) and diodes is proposed. The proposed methodology opens a new paradigm to...
Debashis Dutta, Wouter A. Serdijn, Swapna Banerjee...
This paper explores the architectural implications of integrating computation and molecular probes to form nanoscale sensor processors (nSP). We show how nSPs may enable new compu...
Constantin Pistol, Christopher Dwyer, Alvin R. Leb...