In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
Abstract. Inclusion/exclusion branching is a way to branch on requirements imposed on problems, in contrast to the classical branching on parts of the solution. The technique turne...
The proposed feature selection method aims to find a minimum subset of the most informative variables for classification/regression by efficiently approximating the Markov Blanket ...
This paper addresses the problem of efficiently solving large-scale energy minimization problems encountered in computer vision. We propose an energy-aware method for merging ran...
Taesup Kim, Sebastian Nowozin, Pushmeet Kohli, Cha...
Three essential criteria are important for activity planning, including: (1) finding a group of attendees familiar with the initiator, (2) ensuring each attendee in the group to ...