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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
14 years 11 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
IWPEC
2010
Springer
14 years 11 months ago
Inclusion/Exclusion Branching for Partial Dominating Set and Set Splitting
Abstract. Inclusion/exclusion branching is a way to branch on requirements imposed on problems, in contrast to the classical branching on parts of the solution. The technique turne...
Jesper Nederlof, Johan M. M. van Rooij
ECAI
2010
Springer
14 years 10 months ago
Feature Selection by Approximating the Markov Blanket in a Kernel-Induced Space
The proposed feature selection method aims to find a minimum subset of the most informative variables for classification/regression by efficiently approximating the Markov Blanket ...
Qiang Lou, Zoran Obradovic
CVPR
2011
IEEE
14 years 9 months ago
Variable Grouping for Energy Minimization
This paper addresses the problem of efficiently solving large-scale energy minimization problems encountered in computer vision. We propose an energy-aware method for merging ran...
Taesup Kim, Sebastian Nowozin, Pushmeet Kohli, Cha...
CORR
2011
Springer
148views Education» more  CORR 2011»
14 years 8 months ago
On Social-Temporal Group Query with Acquaintance Constraint
Three essential criteria are important for activity planning, including: (1) finding a group of attendees familiar with the initiator, (2) ensuring each attendee in the group to ...
De-Nian Yang, Yi-Ling Chen, Wang-Chien Lee, Ming-S...