104 search results - page 3 / 21 » Thermal Characterization and Thermal Management in Processor... |
ISLPED
2009
ACM
15 years 4 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
ISPASS
2009
IEEE
15 years 4 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
NOCS
2010
IEEE
14 years 8 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
DAC
2008
ACM
15 years 10 months ago
2008
ACM
Recently, processor power density has been increasing at an alarming rate resulting in high on-chip temperature. Higher temperature increases current leakage and causes poor relia...
HPCA
2001
IEEE
15 years 10 months ago
2001
IEEE
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...