528 search results - page 12 / 106 » Thermal Management in Embedded Systems Using MEMS |
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
DSN
2009
IEEE
15 years 4 months ago
2009
IEEE
It is becoming increasingly common to connect traditional embedded system networks to the Internet for remote monitoring, high-level control and integration. It is necessary to pr...
82
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TVLSI
2008
14 years 9 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
106
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EUROSYS
2007
ACM
15 years 6 months ago
2007
ACM
Virtual memory has been successfully used in different domains to extend the amount of memory available to applications. We have adapted this mechanism to sensor networks, where,...
VLSID
2009
IEEE
15 years 10 months ago
2009
IEEE
The Translation Look-aside Buffer (TLB) is a very important part in the hardware support for virtual memory management implementation of high performance embedded systems. The TLB...