50 search results - page 1 / 10 » Thermal modeling and analysis of 3D multi-processor chips |
134
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MJ
2011
14 years 4 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
51
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INTEGRATION
2010
14 years 8 months ago
2010
108
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DAC
2006
ACM
14 years 11 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
ASPDAC
2006
ACM
15 years 3 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
ICCAD
2006
IEEE
15 years 6 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...