276 search results - page 6 / 56 » Thermal modeling and management of DRAM memory systems |
89
Voted
ASPDAC
2009
ACM
15 years 4 months ago
2009
ACM
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...
ICC
2007
IEEE
15 years 3 months ago
2007
IEEE
1 Routers need buffers to store and forward packets, especially when there is network congestion. With current memory technology, neither the SRAM nor the DRAM alone is suitabl...
MICRO
2006
IEEE
15 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
92
Voted
ISCA
2012
IEEE
12 years 12 months ago
2012
IEEE
Modern memory controllers employ sophisticated address mapping, command scheduling, and power management optimizations to alleviate the adverse effects of DRAM timing and resource...
75
Voted
ASPLOS
2006
ACM
15 years 3 months ago
2006
ACM
Power densities have been increasing rapidly at all levels of server systems. To counter the high temperatures resulting from these densities, systems researchers have recently st...