1635 search results - page 11 / 327 » Thermally Aware Design |
DATE
2008
IEEE
15 years 4 months ago
2008
IEEE
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...
112
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VTS
2006
IEEE
15 years 3 months ago
2006
IEEE
— In this paper, an algorithm for scan vector ordering, PEAKASO, is proposed to minimize the peak temperature during scan testing. Given a circuit with scan and the scan vectors,...
ICCAD
2006
IEEE
15 years 6 months ago
2006
IEEE
In this work we propose a methodology to self-consistently solve leakage power with temperature to predict thermal runaway. We target 28nm FinFET based circuits as they are more p...
67
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ASPDAC
2008
ACM
14 years 11 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
ASPDAC
2008
ACM
14 years 11 months ago
2008
ACM
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...