1635 search results - page 16 / 327 » Thermally Aware Design |
ASPDAC
2005
ACM
15 years 3 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
66
Voted
DATE
2005
IEEE
15 years 3 months ago
2005
IEEE
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling a...
DASC
2006
IEEE
15 years 3 months ago
2006
IEEE
Blade severs are being increasingly deployed in modern datacenters due to their high performance/cost ratio and compact size. In this study, we document our work on blade server b...
67
Voted
ICCD
2007
IEEE
15 years 6 months ago
2007
IEEE
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
DSD
2009
IEEE
15 years 4 months ago
2009
IEEE
—Long test application time and high temperature have become two major issues of system-on-chip (SoC) test. In order to minimize test application times and avoid overheating duri...