1635 search results - page 27 / 327 » Thermally Aware Design |
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MJ
2011
14 years 4 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
DAC
2008
ACM
15 years 10 months ago
2008
ACM
Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of co...
ICCAD
2006
IEEE
15 years 6 months ago
2006
IEEE
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
ISCA
2006
IEEE
14 years 9 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
ISPD
2010
ACM
15 years 4 months ago
2010
ACM
Thermal/power issues have become increasingly important with more and more transistors being put on a single chip. Many dynamic thermal/power management techniques have been propo...