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DATE
2005
IEEE
110views Hardware» more  DATE 2005»
15 years 3 months ago
Rapid Generation of Thermal-Safe Test Schedules
Overheating has been acknowledged as a major issue in testing complex SOCs. Several power constrained system-level DFT solutions (power constrained test scheduling) have recently ...
Paul M. Rosinger, Bashir M. Al-Hashimi, Krishnendu...
ASPDAC
2004
ACM
96views Hardware» more  ASPDAC 2004»
15 years 1 months ago
Mixed-clock issue queue design for energy aware, high-performance cores
- Globally-Asynchronous, Locally-Synchronous (GALS) design style has started to gain interest recently as a possible solution to the increased design complexity, power and thermal ...
Venkata Syam P. Rapaka, Emil Talpes, Diana Marcule...
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ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
15 years 6 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
ICCD
2005
IEEE
134views Hardware» more  ICCD 2005»
15 years 6 months ago
Analytical Model for Sensor Placement on Microprocessors
Thermal management in microprocessors has become a major design challenge in recent years. Thermal monitoring through hardware sensors is important, and these sensors must be care...
Kyeong-Jae Lee, Kevin Skadron, Wei Huang
DAC
2011
ACM
13 years 9 months ago
Throughput maximization for periodic real-time systems under the maximal temperature constraint
We study the problem on how to maximize the throughput for a periodic real-time system under the given peak temperature constraint. We assume that different tasks in our system ma...
Huang Huang, Gang Quan, Jeffrey Fan, Meikang Qiu