1476 search results - page 109 / 296 » Three-dimensional integrated circuits |
134
Voted
DAC
2007
ACM
16 years 6 months ago
2007
ACM
Due to increased variability trends in nanoscale integrated circuits, statistical circuit analysis has become essential. We present a novel method for post-silicon analysis that g...
137
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VTS
2007
IEEE
15 years 11 months ago
2007
IEEE
—As the complexity of the integrated circuits increases, they become more susceptible to manufacturing faults, decreasing the total process yield. Thus, it would be desirable to ...
117
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GLVLSI
2005
IEEE
15 years 10 months ago
2005
IEEE
The ever-increasing number of transistors on a chip has resulted in very large scale integration (VLSI) systems whose performance and manufacturing costs are driven by on-chip wir...
144
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DAC
2011
ACM
14 years 4 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
145
Voted
ISPD
2005
ACM
15 years 10 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...