1476 search results - page 121 / 296 » Three-dimensional integrated circuits |
158
Voted
DFT
2000
IEEE
15 years 8 months ago
2000
IEEE
We present a configuration technique for a Large Area Integrated Circuit (LAIC) which is manufactured by wafer stepping. A LAIC consists of four identical subsystems, i.e., a subs...
130
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DAGSTUHL
2004
15 years 6 months ago
2004
Virtually every system designed today is an amalgam of hardware and software. Unfortunately, software and circuits that communicate across the hardware/software boundary are tedio...
139
Voted
ICCD
2002
IEEE
16 years 2 months ago
2002
IEEE
A variety of factors is making it increasingly difficult and expensive to design and manufacture traditional Application Specific Integrated Circuits (ASICs). This has started a s...
173
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SLIP
2009
ACM
15 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
168
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ISLPED
2010
ACM
15 years 5 months ago
2010
ACM
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...