1476 search results - page 122 / 296 » Three-dimensional integrated circuits |
140
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ICCAD
2010
IEEE
15 years 3 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
153
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DAC
2011
ACM
14 years 4 months ago
2011
ACM
SRAM design has been a major challenge for nanoscale manufacturing technology. We propose a new bit cell repair scheme for designing maximum-information memory system (MIMS). Unli...
137
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SBCCI
2009
ACM
15 years 9 months ago
2009
ACM
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
152
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DAC
2003
ACM
16 years 6 months ago
2003
ACM
In the way they cope with variability, present-day methodologies are onerous, pessimistic and risky, all at the same time! Dealing with variability is an increasingly important as...
120
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DAC
2005
ACM
16 years 6 months ago
2005
ACM
We demonstrate how to use placement to ameliorate the predicted repeater explosion problem caused by poor interconnect scaling. We achieve repeater count reduction by dynamically ...