1476 search results - page 162 / 296 » Three-dimensional integrated circuits |
138
click to vote
ISPD
2003
ACM
15 years 11 months ago
2003
ACM
Design rules in advanced IC manufacturing processes are increasingly problematic for modern router architectures and algorithms. This paper first reviews types and causes of “d...
135
click to vote
GECCO
2003
Springer
15 years 11 months ago
2003
Springer
Power consumption and portability issues are becoming increasingly significant in embedded system architectures. Therefore, it is important that chip architects and integrated circ...
153
click to vote
DAC
1996
ACM
15 years 10 months ago
1996
ACM
: Electromigration induced degradation in integrated circuits has been accelerated by continuous scaling of device dimensions. We present a methodology for synthesizing high-reliab...
139
click to vote
DAC
2005
ACM
15 years 8 months ago
2005
ACM
Traditional corner analysis fails to guarantee a target yield for a given performance metric. However, recently proposed solutions, in the form of statistical timing analysis, whi...
140
click to vote
MR
2002
15 years 5 months ago
2002
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....