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75
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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
15 years 6 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
75
Voted
ETRA
2010
ACM
197views Biometrics» more  ETRA 2010»
15 years 4 months ago
Image ranking with implicit feedback from eye movements
In order to help users navigate an image search system, one could provide explicit information on a small set of images as to which of them are relevant or not to their task. Thes...
David R. Hardoon, Kitsuchart Pasupa
CCS
2009
ACM
15 years 4 months ago
On non-cooperative location privacy: a game-theoretic analysis
In mobile networks, authentication is a required primitive of the majority of security protocols. However, an adversary can track the location of mobile nodes by monitoring pseudo...
Julien Freudiger, Mohammad Hossein Manshaei, Jean-...
FPGA
2009
ACM
159views FPGA» more  FPGA 2009»
15 years 4 months ago
Choose-your-own-adventure routing: lightweight load-time defect avoidance
Aggressive scaling increases the number of devices we can integrate per square millimeter but makes it increasingly difficult to guarantee that each device fabricated has the inte...
Raphael Rubin, André DeHon
85
Voted
WCRE
2009
IEEE
15 years 4 months ago
FAMOOSr 2009 - Workshop on FAMIX and Moose in Software Reengineering
The increasing amount of data available about software systems poses new challenges for re- and reverse engineering research, as the proposed approaches need to scale. In this con...
Simon Denier, Tudor Gîrba