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SLIP
2009
ACM
15 years 4 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
SLIP
2009
ACM
15 years 4 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
UIST
2009
ACM
15 years 4 months ago
2009
ACM
While onboard navigation systems are gaining in importance, maps are still the medium of choice for laying out a route to a destination and for way finding. However, even with a ...
COMSWARE
2008
IEEE
15 years 4 months ago
2008
IEEE
—For modern scientific applications such as astrophysics, astronomy, aerography, and biology, a large amount of storage space is required because of the large-scale datasets. Dat...
ETFA
2008
IEEE
15 years 4 months ago
2008
IEEE
Fieldbus networks have significantly improved flexibility and management in classic building automation domains. However, the costs of such installations are still greatly affec...